The Government of India has approved the first batch of seven projects under the Electronics Components Manufacturing Scheme (ECMS), with a total investment exceeding ₹5,500 crore. These projects are expected to generate ₹36,559 crore in production value and create over 5,100 direct jobs. The approved units are spread across Tamil Nadu, Andhra Pradesh, and Madhya Pradesh, signaling a strong national push toward building a self-reliant and export-oriented electronics component ecosystem.
According to Union Minister for Electronics and IT, Ashwini Vaishnaw, the new facilities will help India achieve 100% domestic demand fulfillment for copper-clad laminates, 20% for printed circuit boards (PCBs), and 15% for camera modules, while 60% of the total production will be exported.
The initiative marks a significant milestone in India’s shift from assembling finished electronic products to manufacturing modules, materials, and machinery used in the production process. These projects are also expected to reduce import dependence, build trusted supply chains, and create high-skill jobs across key sectors including defence, telecom, electric vehicles (EVs), and renewable energy.
With this move, India takes a decisive step toward strengthening its electronics manufacturing base and achieving its vision of becoming a global hub for component and materials production.
Overwhelming response for ECMS
The scheme has received wonderful response from both domestic and global companies. 249 applications have been recieved. These represents ₹1.15 lakh crore investment, ₹10.34 lakh crore production, and 1.42 lakh jobs to be created. It is the highest-ever investment commitment in India’s electronics sector.
Today marks the approval for seven projects worth ₹5,532 crore. These projects will lead to production of components worth ₹36,559 crore and creation of over 5,100 direct jobs.
The approved units are spread across Tamil Nadu (5), Andhra Pradesh (1), and Madhya Pradesh (1). This reinforces the balanced regional growth and expanding high-tech manufacturing beyond metros.
Bridging the Demand–Supply Gap
Union Minister Sh. Ashwini Vaihnaw informed, “20% of our domestic demand of PCBs and 15% of Camera Module sub-assembly will be met through production from these plants.”
He also mentioned that the demand of copper clad Laminate will now completely be domestically met. The additional 60% of production through these plants will be exported.
Product Details
The approved projects cover key components like High-Density Interconnect (HDI) PCBs, Multi-Layer PCBs, Camera Modules, Copper Clad Laminates, and Polypropylene Films.
Camera modules are compact imaging units that capture photos and videos in electronic devices. Its production in India will enable its usage in smartphones, drones, laptops, tablets, medical instruments, robots, and automotive systems.
HDI and Multi-Layer PCBs are the core circuit boards that connect and control every electronic device. These are used in smartphones, laptops, automotive and industrial systems.
Strategic Breakthroughs in Base Materials
ECMS also marks India’s strong entry into component materials manufacturing.
For the first time, India will establish a Copper Clad Laminate (CCL) manufacturing facility. CCL acts as a base component for manufacturing Multi-layer PCBs. These PCBs go into every electronic equipment. Right now it is imported.
The Polypropylene Films is the key material used in manufacturing capacitors. This component will be made in India for Consumer Electronics, Automotive, ICT, Industrial & Manufacturing, Telecommunications & Computing equipments.
Economic and Industrial Impact
- These projects will reduce import dependence and and lower product prices in the domestic market
- These projects will create high-skill jobs in manufacturing and R&D
- Trusted supply chains will be built for defence, telecom, EVs, and renewable energy
India is on its journey towards becoming a product nation, capable of designing, manufacturing, and exporting end-to-end electronic equipment. The scheme complements PLI and the India Semiconductor Mission (ISM).
It completes the seamless value chain, from devices to chips, components to materials, and from manufacturing to innovation.
(This content is sourced from a syndicated feed. The Japan India Manufacturing Journal website assumes no responsibility or liability for its accuracy, completeness, or content.)
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