Siemens Digital Industries Software has announced a collaboration with United Microelectronics Corporation (UMC), a leading global semiconductor foundry, to implement Siemens’ mPower™ software for electromigration (EM) and IR drop analysis. This integration helps chip designers optimize performance and improve reliability.
The mPower solution offers scalable capabilities, allowing users like UMC to perform accurate analysis on larger chip layouts. Its transistor-level pre-layout EM and IR drop features support early detection of potential issues, enabling performance optimization during the initial design stages.
Following a thorough evaluation, UMC successfully utilized mPower’s automated processes to conduct comprehensive full-chip SRAM circuit analysis. This resulted in precise IR drop distribution assessments and facilitated early-stage risk identification.
“By integrating Siemens’ mPower into our design verification flow, we’re enhancing our ability to identify and address potential issues earlier in the development cycle,” said Osbert Cheng, vice president of device technology development & design support, UMC. “This aligns perfectly with modern design requirements and helps ensure superior product quality for our customers.” Key benefits gained with the implementation of mPower at UMC:
- Accelerated time-to-market through industry-leading scalability and rapid verification.
- Enhanced product reliability through early detection and resolution of potential issues.
- Seamless integration with existing design workflows, enabling comprehensive power analysis.
“Our work with UMC to successfully implement mPower at UMC marks a significant advancement in semiconductor design verification capabilities,” said Ankur Gupta, senior vice president and general manager of Digital Design Creation Platform, Siemens Digital Industries Software. “As the semiconductor industry addresses the ever-growing challenge of complexity, leaders and pioneers are looking to Siemens’ EDA portfolio to accelerate the design process and help them deliver capable, reliable products to market.”
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