HomeIndustry updateSemiconductor

Made-in-India Secure Chip to Power Future Digital Identity

ChipSync and Cortus Join Forces for AI-Driven Vehicle Solutions
Nissan Unveils Solar-Powered Sakura Prototype at Japan Mobility Show 2025
SEMICON India 2025 Concludes, Boosting Nation’s Chip Journey

At SEMICON India 2025, a landmark Tripartite Agreement was signed between L&T Semiconductor Technologies Ltd (LTSCT), IIT Gandhinagar, and the Centre for Development of Advanced Computing (C-DAC) to drive the research, development, and commercialization of secure integrated circuit (IC) solutions, beginning with the Electronic Passport (e-Passport).

The signing ceremony was presided over by Mr. Ashwini Vaishnaw, Minister of Railways, Communications, and Electronics & Information Technology, along with Mr. S Krishnan, Secretary, MeitY; Prof. Rajat Moona, Director, IIT Gandhinagar; Mr. Magesh Ethirajan, Director General, C-DAC; and Shri Sandeep Kumar, CEO, L&T Semiconductor Technologies.

Key Highlights:

  • Development of a fully indigenous Secure IC solution, with all intellectual property (IP) residing in India.

  • Strengthening of India’s technological sovereignty in the semiconductor domain.

  • Establishing the foundation for next-generation cryptographic products and secure applications beyond e-Passports.

This collaboration unites industry expertise, academic excellence, and government-led R&D, creating a strong base for India’s secure semiconductor ecosystem.

Aligned with the vision of Digital India and Atmanirbhar Bharat, the initiative marks a decisive step toward a self-reliant and secure future for India in digital identity and advanced semiconductor innovation.

(This content is sourced from a syndicated feed. The Japan India Manufacturing Journal website assumes no responsibility or liability for its accuracy, completeness, or content.)

COMMENTS

WORDPRESS: 0
DISQUS: