Intel CEO Lip-Bu Tan, a key figure in the PC chip industry, is expected to visit Odisha later this year for the ground-breaking ceremony of the semiconductor plant operated by 3D Glass Solutions, according to a senior state government official on September 3.
The ground-breaking ceremony for SiCSem, a silicon carbide (SiC) company, is scheduled for next month, with commercial chip production anticipated to begin in two years, said Vishal Kumar Dev, Principal Secretary of the Odisha Electronics and IT Department.
“Chief Minister Mohan Charan Majhi was present, and both SiCSem and 3DGS have committed to initiating the unit promptly. The ground-breaking for SiCSem will occur next month, and 3D Glass Solutions is awaiting a date from Intel CEO Lip-Bu Tan, who also intends to visit Odisha. This visit will coincide with the ground-breaking ceremony, which is hoped to take place within the next two to three months,” Dev stated.
3D Glass Semiconductor Packaging Unit
The semiconductor packaging unit for 3D Glass will be established by Heterogeneous Integration Packaging Solutions Pvt Ltd, supported by major US technology firms including Intel, Lockheed Martin, and Applied Materials. The project involves an investment of Rs 1,943 crore and targets an annual production capacity of 5 crore units.
This initiative marks the first semiconductor project in India involving Intel Corporation, alongside other global technology partners.
SiCSem: India’s First Compound Semiconductor Fab
SiCSem Private Limited is collaborating with UK-based Clas-SiC Wafer Fab to establish an integrated facility for Silicon Carbide (SiC) at InfoValley, Bhubaneswar. This will be the country’s first compound semiconductor fabrication plant.
Additionally, RIR Power Electronics has informed the Odisha Chief Minister that their SiC wafer fabrication facility, with an investment of Rs 618 crore, is already operational. Commercial production is scheduled to begin in March 2026.
Odisha’s Revised Semiconductor Policy
The Odisha government has introduced a revised semiconductor policy offering 50 percent of the total central government incentives, along with additional incentives to attract talent. Engineering students choosing semiconductor as a subject will receive approximately Rs 10,000, with further support to develop their own chips for commercial production.
Electronics Manufacturing Investments
The state government has also signed two agreements for electronics manufacturing initiatives, totaling around Rs 2,655 crore.
On September 2, two MoUs were inked:
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TopTrack Hi-Tech PCB: Rs 1,005 crore advanced PCB manufacturing facility
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Sancode Technologies Limited: Rs 1,650 crore facility leveraging technology partners Silicon Connect, Advanced Packaging Institute & Research Center (APIRC), and Inari Amertron Berhad
(This content is sourced from a syndicated feed. The Japan India Manufacturing Journal website assumes no responsibility or liability for its accuracy, completeness, or content.)
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