Japanese semiconductor company Renesas Electronics has successfully taped out and begun sampling 3-nanometre (3nm) automotive chips designed by its India-based teams in Noida and Bengaluru. The advanced chips, among the fastest and most sophisticated globally, mark a major milestone for India’s semiconductor design capabilities, demonstrating the technical expertise of the local engineering workforce.
“Taping out” refers to finalizing and submitting a complete integrated circuit design to a foundry for manufacturing. While commercial deployment timelines are yet to be confirmed, the chips are currently being evaluated by global partners.
Strategic Expansion in India
Renesas is partnering with the Murugappa Group’s CG Power and Thailand-based Stars Microelectronics to establish an Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, under the name CG Semi. Renesas holds a minority stake in the venture, which will support both its own packaging and testing needs as well as those of other semiconductor firms.
The company has rapidly scaled its Indian workforce to around 800 engineers in the past year, with plans to exceed 1,000, aiming for India operations to contribute 10% of global revenue by 2030. Renesas clarified that it is not planning to set up local fabrication plants, focusing instead on design and testing partnerships to support global production.
This achievement underscores India’s growing role in the global semiconductor ecosystem, particularly in high-end automotive chip design.
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