Mitsuboshi Diamond Industrial Co., Ltd. (MDI) will be participation in SEMICON Japan 2025. The event will take place from December 17 to 19, 2025, at Tokyo Big Sight.
For more than 90 years, MDI has built deep expertise in brittle material processing technology. In recent years, the company has accelerated innovation in the semiconductor sector particularly in the processing of high-demand compound semiconductors like silicon carbide (SiC).
At SEMICON Japan 2025, MDI will present a range of interactive exhibits that highlight the capabilities of its proprietary Scribe & Break (SnB) method, enabling visitors to experience the mechanism and advantages of this unique singulation approach. In addition, MDI will give the first-ever technical reveal of its new wafer singulation system for SiC and other hard-to-process materials.
Key Exhibits
● World Debut: New SiC Wafer Singulation System “DIALOGIC PLUS+”
MDI will unveil the complete technical details and equipment configuration of DIALOGIC PLUS+, the latest model in its DIALOGIC Series.
The system is engineered for enhanced precision, efficiency, and productivity when processing hard, high-hardness materials such as SiC wafers—an area seeing rapid market expansion.
Technical experts will walk visitors through advanced process conditions, automation compatibility, and productivity-boosting features via detailed panel displays.
● Hands-on Demonstration: Experience the Scribe & Break (SnB) Method
A dedicated demonstration area will show how the SnB method works, allowing attendees to experience the controlled breaking process firsthand.
This technology uses a diamond cutter to scribe a precise line before applying stress to cleanly and efficiently separate the material offering advantages over traditional sawing-based dicing.
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