Category: Uncategorized

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Aeva and Bendix Team Up for Next-Gen Truck Safety

Aeva and Bendix Team Up for Next-Gen Truck Safety

Aeva® has announced a strategic collaboration with Bendix Commercial Vehicle Systems to develop next-generation active safety and collision mitigation [...]

Teledyne Launches Compact DDR4 Memory Module

Teledyne HiRel Semiconductors, recently announced the release of the TDD416Y12NEPBM01—a compact DDR4 memory module screened and qualified as an Enhanc [...]
onsemi Expands SiC Collaboration with Schaeffler

onsemi Expands SiC Collaboration with Schaeffler

onsemi recently announced an expanded collaboration with motion technology leader Schaeffler through a new design win that utilizes onsemi’s next-gene [...]
Siemens and UMC Collaborate to Enhance Chip Reliability with mPower Software

Siemens and UMC Collaborate to Enhance Chip Reliability with mPower Software

Siemens Digital Industries Software has announced a collaboration with United Microelectronics Corporation (UMC), a leading global semiconductor found [...]
Tata Electronics and Bharat Electronics Join Forces to Accelerate India’s Electronics and Semiconductor Goals

Tata Electronics and Bharat Electronics Join Forces to Accelerate India’s Electronics and Semiconductor Goals

Tata Electronics, a pioneering leader in India’s electronics manufacturing sector, today announced a Memorandum of Understanding (MoU) with Bharat [...]
“In the machine tool industry, data-driven technologies are revolutionising how machining operations are optimised”

“In the machine tool industry, data-driven technologies are revolutionising how machining operations are optimised”

“By capturing key parameters such as speed, feed, depth of cut, spindle load,temperature, torque, and vibrations, manufacturers can monitor real-time [...]
Cimatron’s New Tool Simplifies Stamping Die Cost Estimation

Cimatron’s New Tool Simplifies Stamping Die Cost Estimation

Cimatron released Cimatron DieQuote, a new cloud-based software solution that enables the rapid creation of comprehensive stamping die cost estim [...]
Enhance production control and efficiency with Meusburger cavity pressure sensors

Enhance production control and efficiency with Meusburger cavity pressure sensors

In the domain of process monitoring in injection moulding, cavity pressure is a decisive parameter which contributes significantly to process qua [...]
EMO Hannover: A Global Stage for Innovation, AI, and Strategic Collaboration in Manufacturing

EMO Hannover: A Global Stage for Innovation, AI, and Strategic Collaboration in Manufacturing

As global manufacturing undergoes a significant transformation, platforms like EMO Hannover are emerging as critical enablers of innovation, coll [...]
Kia India and IIT-Tirupati enter into a strategic MoU to advance Engineering Excellence and Drive Technological Innovation

Kia India and IIT-Tirupati enter into a strategic MoU to advance Engineering Excellence and Drive Technological Innovation

Kia India, a leading mass premium carmaker of the country, has signed a Memorandum of Understanding (MoU) with the Indian Institute of Technology, [...]
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