Indium Corporation has announced the global launch of WS-910 Flip-Chip Flux, a water-soluble dipping flux developed for advanced semiconductor devices.
The WS-910 Flip-Chip Flux delivers superior residue cleaning, making it highly compatible with molded and capillary underfill. It also provides high tackiness, aiding in the secure placement of large die during the reflow process. This new addition enhances Indium Corporation’s portfolio of semiconductor assembly solutions for advanced packaging and high-reliability applications.
Halogen-free WS-910 Flip-Chip Flux offers multiple advantages, including:
-
High tackiness to reduce non-wet open defects and cold joints
-
Excellent solderability across various surface types
-
Consistent dipping performance for stable yields over time
-
Easy cleaning with pure room-temperature deionized water
-
Designed for Pb-free applications and compatible with all high-Sn solders
-
Works well with both conventional and modified ultrafiltration systems
Indium Corporation’s flip-chip flux series is engineered to tackle miniaturization challenges such as thin or warped substrates and fine-pitch, high I/O assemblies. The range includes both water-soluble and ultra-low residue no-clean formulations, offering a sustainable alternative to traditional fluxes.
(This content is sourced from a syndicated feed. The Japan India Manufacturing Journal website assumes no responsibility or liability for its accuracy, completeness, or content.)
COMMENTS