Teledyne HiRel Semiconductors, recently announced the release of the TDD416Y12NEPBM01—a compact DDR4 memory module screened and qualified as an Enhanced Product (EP). The module is rated for operation across a wide temperature range, from –40°C to +105°C.
The TDD416Y12NEPBM01 is a solder-down DDR4-3200 memory solution designed to deliver high bandwidth in a space-saving form factor—smaller than a postage stamp. Packaged in a 216-ball BGA and measuring just 22mm x 22mm, it is ideal for systems where both board space and high performance are critical.
Its streamlined design integrates memory, termination, and passive components into a single, unified 22mm² module—effectively replacing several discrete components and significantly reducing layout complexity. Unlike monolithic ECC memory modules, the TDD416Y12NEPBM01 enables error correction through an optional companion ECC, offering greater architectural flexibility. This approach delivers key technical benefits, including thermal isolation, enhanced design flexibility, and overall cost savings.
The TDD416Y12NEPBM01 module was developed to meet the growing need for embedded platforms that demand high-speed memory in tight enclosures. Whether routing alongside modern SoCs, CPUs, or FPGAs, the module offers clean signal integrity, and thermal flexibility. It pairs well with processors that support x64 or x72 memory buses, including, Xilinx Versal, Microchip PolarFire, NXP Layerscape, Xilinx Ultrascale+, Intel Atom, as well as Teledyne’s own LS1046-Space and a wide range of ARM-based compute cores. In keeping with industry trends, the DDR4 delivers 42% power savings, 42% jitter reduction, and 39% PK/PK savings when compared to traditional SODIMMs.
“This module approach gives customers the freedom to tailor reliability to each mission profile,” said Mont Taylor, Vice President of Business Development at Teledyne HiRel.
He further said, “It’s ideal for mixed deployments. The real strength of the TDD416Y12NEPBM01 lies in its versatility — socketless installation, reduced BOM, and a fully self-contained design. We’re helping system architects shrink their memory footprint without sacrificing bandwidth.”
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