Signing Ceremony (Front Left) He Weiwei, General Manager, BASiC Semiconductor Co., Ltd.; (front right) Noriyasu Kurihara, Director, Vice President of Semiconductor Division, Toshiba Electronic Devices & Storage Corporation
Toshiba Electronic Devices & Storage Corporation and BASiC Semiconductor Co., Ltd. have signed a Memorandum of Understanding (MoU) to establish a strategic partnership in power module products.
The collaboration will leverage Toshiba’s advanced power semiconductor technologies—including silicon carbide (SiC) and insulated gate bipolar transistors (IGBT)—together with BASiC’s high-efficiency, high-reliability module architecture. By combining these strengths, the companies aim to deliver competitive, next-generation power modules to meet the growing demands of automotive and industrial applications worldwide.
The high power density and stable quality of Toshiba Electronic Devices & Storage’s power semiconductors contribute to improved power conversion efficiency and reduced environmental impacts. The company’s SiC metal-oxide-semiconductor field-effect transistors (MOSFET) secure low on-resistance and high reliability, while its IGBT have a rich market record of delivering high current and high reliability.
BASiC is a leading company in the SiC power devices. It develops SiC chips and power modules, and its many products that meet automotive standards and for industrial applications have been adopted in a various fields, including electric vehicles, solar power generation and storage systems.
This strategic partnership between the companies will strengthen the market competitiveness of both and enable the provision of innovative solutions.
Toshiba Electronic Devices & Storage will continue to meet the diverse needs of its customers and to contribute to mitigating global warming by developing reliable, higher performance products. The two companies will also consider various forms of cooperation and aim to grow and develop both businesses while supporting the realization of a sustainable society.
Toshiba Electronic Devices & Storage’s sales subsidiary in China, Toshiba Devices & Storage (Shanghai) Co., Ltd., will jointly exhibit with BASiC and BASiC’s affiliate, Bronze Technologies Ltd., at “PCIM Asia Shanghai 2025,” which will be held in Shanghai from September 24 to 26, 2025.
COMMENTS